Rigid 10K Overview

Rigid 10K is a highly glass-filled engineering resin for precise industrial components that must resist significant load with minimal bending. Published data show high stiffness, elevated heat-deflection performance, broad short-term solvent resistance, and a smooth matte finish. Final performance should be verified for the intended geometry, post-processing condition, and service environment.

Design Advantages

  • Post-cured tensile modulus up to 11 GPa, depending on finishing condition
  • Heat deflection temperature up to 238 °C at 0.45 MPa
  • Low 24-hour weight gain across the published solvent panel
  • Useful for short-run molds, inserts, fixtures, fluid-exposed parts, and aerodynamic models

Application Fit

  • Short-run injection molds, inserts, and forming tools
  • Heat-resistant and fluid-exposed jigs, fixtures, and components
  • Rigid prototypes simulating glass- or fiber-filled thermoplastics
  • Aerodynamic test models and dimensionally stable industrial parts

Material Specifications

ItemPublished Value
Material familyGlass-filled engineering photopolymer
Tensile modulus10 GPa, standard post-cure
Flexural strength126 MPa, standard post-cure
HDT at 0.45 MPa163 °C, standard post-cure
Thermal expansion47 µm/m/°C, standard post-cure
FlammabilityUL 94 HB at 3 mm

Material Properties

Mechanical and Thermal Properties

PropertyGreen70 °C Cure70 °C + 90 °CMedia Blasted
Ultimate tensile strength55 MPa65 MPa53 MPa88 MPa
Tensile modulus7.5 GPa10 GPa10 GPa11 GPa
Elongation at break2.0%1.0%1.0%1.7%
Flexural strength84 MPa126 MPa103 MPa158 MPa
Flexural modulus6.0 GPa9.0 GPa10 GPa9.9 GPa
Notched Izod16 J/m16 J/m18 J/m20 J/m
Unnotched Izod41 J/m47 J/m41 J/m130 J/m
HDT at 0.45 MPa65 °C163 °C218 °C238 °C
HDT at 1.8 MPa56 °C82 °C110 °C92 °C
Thermal expansion, 0-150 °C48 µm/m/°C47 µm/m/°C46 µm/m/°C41 µm/m/°C

Electrical and Fire Properties

Electrical Characterization

PropertyPublished Value
Dielectric constant3.4 at 1 GHz; 3.3 at 10 GHz
Loss tangent0.036 at 1 GHz; 0.0074 at 10 GHz
Volume resistivity1.1 x 1015 Ω·cm
Surface resistivity6.9 x 1013 Ω
Dielectric strength458 V/mil

Fire Smoke and Toxicity

TestPublished Result
FlammabilityUL 94 HB at 3 mm
Smoke density, flaming2 at 90 s; 95 at 4 min; maximum 132
Smoke density, non-flaming0 at 90 s; 1 at 4 min; maximum 63
Toxic gas generationPublished BSS 7239 values below listed limits

Solvent Compatibility

Fluid24 H Weight Gain
Acetic acid, 5%<0.1%
Acetone<0.1%
Isopropyl alcohol<0.1%
Bleach, about 5% NaOCl0.1%
Butyl acetate0.1%
Diesel fuel0.1%
Diethylene glycol monomethyl ether0.4%
Hydraulic oil0.2%
Skydrol 50.6%
Hydrogen peroxide, 3%<0.1%
Isooctane, gasoline analogue0%
Mineral oil, light0.2%
Mineral oil, heavy<0.1%
Salt water, 3.5% NaCl0.1%
Sodium hydroxide, 0.025% pH 100.1%
Water<0.1%
Xylene<0.1%
Concentrated hydrochloric acid0.2%
Tripropylene glycol monomethyl ether0.4%

Post Processing Basis

The standard post-cure condition is 60 minutes at 70 °C. The extended thermal condition adds 125 minutes at 90 °C. Media-blasted values were measured after the standard 70 °C cure. These conditions describe the published specimens and should not be treated as universal performance guarantees.

Design and Qualification Notes

Rigid 10K is designed for stiffness and dimensional stability rather than high elongation or impact toughness. Account for stress concentrations, brittle failure modes, fastener loads, thermal cycling, surface treatment, and fluid exposure. Solvent results report short-term mass change only and do not establish long-term retention of mechanical properties.

Published Data and Qualification