PLA Basic Overview

PLA Basic is a 1.75 mm polylactic acid filament designed for straightforward, high-speed printing. It combines stiffness and strength for general prototyping and production-support applications, with published print speeds up to 250 to 300 mm/s under suitable conditions.

Why PLA Basic

  • Easy processing and broad equipment compatibility for rapid iteration
  • Balanced stiffness, strength, toughness, and Z-layer performance
  • High-speed printing capability for efficient prototype and fixture production
  • Useful for visual models, fit checks, jigs, fixtures, housings, and low-temperature end-use parts

Product Specifications

ItemPublished Value
Filament diameter1.75 mm
Net filament weight1 kg
Spool materialABS with 70 °C temperature resistance
Spool size200 mm diameter x 67 mm height

Material Properties

Physical and Thermal Properties

PropertyTest MethodPublished Value
DensityISO 11831.24 g/cm3
Melt index210 °C at 2.16 kg23.2 ± 3.5 g/10 min
Melting temperatureDSC at 10 °C/min160 °C
Glass transition temperatureDSC at 10 °C/min60 °C
Crystallization temperatureDSC at 10 °C/minNot reported
Vicat softening temperatureISO 306 and GB/T 163357 °C
Heat deflection at 1.8 MPaISO 7554 °C
Heat deflection at 0.45 MPaISO 7557 °C
Saturated water absorption25 °C and 55% RH0.43%

Mechanical Properties

PropertyTest MethodPublished Value
Young’s modulus X/YISO 527 and GB/T 10402,580 ± 220 MPa
Young’s modulus ZISO 527 and GB/T 10402,060 ± 170 MPa
Tensile strength X/YISO 527 and GB/T 104035 ± 4 MPa
Tensile strength ZISO 527 and GB/T 104031 ± 3 MPa
Elongation at break X/YISO 527 and GB/T 104012.2 ± 1.8%
Elongation at break ZISO 527 and GB/T 10407.5 ± 1.3%
Flexural modulus X/YISO 178 and GB/T 93412,750 ± 160 MPa
Flexural modulus ZISO 178 and GB/T 93412,370 ± 150 MPa
Flexural strength X/YISO 178 and GB/T 934176 ± 5 MPa
Flexural strength ZISO 178 and GB/T 934159 ± 6 MPa
Impact strength X/YISO 179 and GB/T 104326.6 ± 2.8 kJ/m2; notched 7.9 ± 1.2 kJ/m2
Impact strength ZISO 179 and GB/T 104313.8 ± 0.9 kJ/m2

Printing Settings

Recommended Printing Settings

SettingRecommendation
Drying before printingForced-air oven 50 °C for 8 h; X1 heatbed 60 to 70 °C for 12 h
Printing and storage humidityBelow 20% RH sealed with desiccant
Nozzle size0.2, 0.4, 0.6, or 0.8 mm
Nozzle temperature190 to 230 °C
Bed typeCool Plate, High Temperature Plate, or Textured PEI Plate
Bed preparationGlue
Cooling fanOn
Printing speedBelow 300 mm/s
Retraction0.6 to 1.0 mm at 20 to 40 mm/s
Chamber temperature25 to 45 °C
Overhang and bridging55 degree maximum overhang; 30 mm maximum bridge
Support materialSupport for PLA

Source Specimen Conditions

ParameterSource Condition
Nozzle temperature220 °C
Bed temperature35 °C
Printing speed200 mm/s
Infill density100%
Post-print conditioningAnnealed and dried at 55 °C for 8 h before testing

Other Physical and Chemical Characteristics

CharacteristicPublished Information
CompositionPLA
Odor and skin hazardsOdorless; source reports no skin hazard
Chemical stabilityStable under normal storage and handling conditions
Water solubilityInsoluble
Acid and alkali resistanceNot resistant
Organic solvent resistanceNot resistant to some organic solvents
Oil and grease resistanceResistant to most kinds of oil and grease
FlammabilityFlammable; combustion products are water and carbon oxides

Design and Validation Considerations

  • Keep sustained-use temperatures comfortably below the published 54 to 57 °C heat-deflection and Vicat range unless the final part has been validated.
  • Account for orientation effects: the source reports lower Z-direction modulus, strength, and elongation than X/Y values.
  • Dry and store filament below 20% RH with desiccant when consistent processing and surface quality are important.
  • If annealing, use a controlled forced-air oven with uniform temperature. Bambu Lab suggests 50 to 60 °C for 6 to 12 hours and warns that parts can deform or warp.
  • Do not use a microwave or household kitchen oven for filament drying or part annealing.

Data Provenance